Working Student Adhesive Technology (f/m/x)

Carl Zeiss Jena GmbH

Oberkochen Until 10/9/2026 H-1B sponsor history First posted August 10, 2026 Last posted August 10, 2026
Job description

Enabler for smaller, more powerful, and more energy-efficient microchips 

  

Working for tomorrow today.  

Around 80 percent of all microchips worldwide are produced using ZEISS technologies. As the centerpiece of every electronically controlled system, they have become an integral part of our everyday lives – whether in smartphones, smart homes or smart factories. ZEISS is a technology leader in the field of semiconductor manufacturing equipment. With high-precision lithography optics, photomask systems and process control solutions, ZEISS enables the production of ever smaller, increasingly powerful, and more energy-efficient microchips, and thus plays a pivotal role in the age of micro- and nanoelectronics.  


Your Role

With us, you have the opportunity to perfectly combine your studies with practical experience while actively contributing to exciting projects. This allows you to gain valuable skills, expand your network, and grow both professionally and personally.

  • Support the development and qualification of adhesive technologies for opto‑mechanical assemblies and systems under guidance from experienced development engineers (f/m/x)
  • Contribute to the execution, documentation, and analysis of experiments to characterize adhesives, materials, and manufacturing processes

Your Profile

  • Currently enrolled student (f/m/x) in a Bachelor’s or Master’s degree program with a focus on engineering or natural sciences
  • Strong interest in adhesive technologies, materials science, polymer chemistry, or manufacturing technologies
  • Initial practical experience in a laboratory, in technical projects, or in an academic/scientific environment is an advantage
  • Strong analytical skills combined with a structured and thorough way of working
  • Confident user of MS Office, especially Excel and PowerPoint

Sounds exciting? Then become part of #teamZEISS and help us shape the future! Please provide your complete application documents (CV, transcript of records, etc.).

Your ZEISS Recruiting Team:

Verena Hald
About this role

Summary

Support development and testing of adhesive technologies for microchip systems.

Job title

Working Student Adhesive Technology (f/m/x)

Experience level

student

Industry

technology

Location requirements

Oberkochen, Germany; no remote work allowed

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

MS OfficeExcelPowerPoint

Preferred skills

laboratory experiencetechnical projectsscientific environment

Specializations

adhesive technologiesmaterials sciencepolymer chemistrymanufacturing technologies
Locations

Structured locations inferred from the posting.

73447 Oberkochen, Germany

On-site City