Wire Bond Maintenance Manager
GB62 Nexperia United Kingdom
Apply to this jobWire Bond Maintenance Manager
Job Summary
Lead the maintenance organization to maximize equipment uptime, reliability, and manufacturing productivity for Wire Bond operations. Drive preventive maintenance strategies, equipment reliability improvement, cost optimization, and team development to support production and business objectives.
What You Need to Do
- Lead and develop a team of Maintenance Engineers and Technicians.
- Develop and implement preventive and predictive maintenance strategies for Wire Bond equipment.
- Drive Overall Equipment Effectiveness (OEE) improvement initiatives.
- Minimize equipment downtime and improve Mean Time to Repair (MTTR) and Mean Time Between Failures (MTBF).
- Lead equipment reliability and continuous improvement projects to enhance manufacturing performance.
- Manage spare parts inventory, maintenance resources, and budget effectively.
- Support new equipment installation, qualification, buy-off, and production ramp activities.
- Ensure preventive maintenance (PM) compliance and maintenance effectiveness across all Wire Bond equipment.
- Lead root cause analysis and corrective actions for major equipment failures and recurring issues.
- Collaborate with Process Engineering, Production, and Quality teams to improve equipment performance, yield, and product quality.
- Drive cost reduction and maintenance optimization initiatives.
- Ensure compliance with Safety, ESD, ISO, and Quality Management System requirements.
What You Need to Have
- Bachelor's Degree in Mechanical, Electrical, Mechatronics, or a related Engineering discipline.
- Minimum 10 years of experience in semiconductor manufacturing with strong exposure to equipment maintenance.
- Minimum 5 years of leadership experience managing Engineering or Maintenance teams.
- Strong knowledge of Wire Bond equipment and semiconductor assembly manufacturing processes.
- Experience in equipment reliability, preventive maintenance, troubleshooting, and continuous improvement initiatives.
- Familiarity with TPM, Lean Manufacturing, SPC, and root cause analysis methodologies.
- Strong leadership, communication, problem-solving, and project management skills.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.
Summary
Lead maintenance team to optimize Wire Bond equipment, reliability, and production performance.
Job title
Wire Bond Maintenance Manager
Experience level
10+ years
Minimum experience
10+ years exp
Industry
semiconductor
Location requirements
Seremban, onsite work only.
Salary
Not specified
Visa sponsorship
H-1B sponsor history
Management role
Yes
Required skills
Preferred skills
Specializations
Structured locations inferred from the posting.
Seremban, Negeri Sembilan, Malaysia