Wire Bond Equipment Engineer
CZ61 NXP Semiconductors Czech Republic s.r.o.
Apply to this job Bangkok Until 8/21/2026 7+ years exp H-1B sponsor history First posted June 14, 2026 Last posted June 14, 2026
Job description
Responsibilities:
- Lead and manage wire bond equipment overhaul and rebuild activities to ensure maximum machine uptime and reliability.
- Develop and implement preventive maintenance programs and calibration procedures for wire bond machine.
- Drive continuous improvement initiatives focused on equipment performance, process optimization, and quality enhancement.
- Analyze equipment downtime and root causes; implement corrective actions to minimize recurrence.
- Collaborate with cross-functional teams to support production goals, improve equipment utilization, and meet customer quality requirements.
- Develop innovative solutions and automation systems to enhance machine connectivity, reduce manual intervention, and improve operational efficiency.
- Provide technical training and mentorship to engineers on wire bond equipment troubleshooting, overhaul, and process control.
- Ensure compliance with environmental, safety, and quality standards in all equipment-related activities.
- Lead projects that deliver measurable improvements in productivity, cost reduction, and quality performance.
Qualifications:
- Education: Bachelor’s degree in Electronics, Electrical, Mechanical, or related Engineering field.
- Experience: Minimum 7 years of hands-on experience in wire bond equipment engineering or semiconductor assembly operations.
- Proven expertise in wire bond machine platforms.
- Strong background in machine overhaul, rebuild, calibration, preventive, and predictive maintenance.
- Demonstrated ability to manage major repairs, restoration, and equipment qualification.
- Solid understanding of quality systems, SPC, and root cause analysis for equipment-related issues.
- Experience in continuous improvement methodologies (Lean, Six Sigma) and driving cost-reduction projects.
- Ability to develop and implement automation and innovative solutions for equipment and process improvement.
- Excellent analytical, troubleshooting, and problem-solving skills.
- Strong leadership and communication skills; ability to train and mentor technical teams.
- Familiarity with data analytics and machine connectivity projects is a plus.
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About this role
Summary
Lead wire bond equipment maintenance, improvement, automation, and troubleshooting.
Job title
Wire Bond Equipment Engineer
Experience level
7+ years
Minimum experience
7+ years exp
Industry
semiconductor
Location requirements
Bangkok, remote work not specified
Salary
Not specified
Visa sponsorship
H-1B sponsor history
Management role
No
Skills & keywords
Required skills
wire bondmaintenancecalibrationroot cause analysisLeanSix Sigma
Preferred skills
automationdata analyticsmachine connectivity
Specializations
wire bondequipment engineeringautomationsmaintenancesemiconductor
Locations
Structured locations inferred from the posting.
Bangkok, Thailand
Work arrangement unknown City
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