Wafersort Process Engineer (R&D Engineer Hardware)

Broadcom Corporation

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Malaysia-Penang B 1 & 2 Until 8/21/2026 5+ years exp H-1B sponsor history First posted April 22, 2026 Last posted April 22, 2026
Job description

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Job Description:

Job Description:

  • Central technical liaison / Primary interface between internal team (RND/NPI/Packaging/QA) and wafer sort CM.
  • Work closely with wafer sort CM on process development / improvement and process defect related activities.
  • Managing other wafer sort CM related activities.
  • Able to work independently with minimum supervision and set appropriate priorities to ensure timely delivery.

Minimum Requirement:

  • Bachelor/Master/PhD degree (or equivalent qualification) in Electrical/Electronic engineering.
  • Minimum 5 years (preferably 8 years)working experience in wafer foundry / wafer sort process related fields.
  • In-depth process knowledge on process like bumping, dicing, backgrind, tape & reel…
  • Able to speak fluently in Chinese & English.
  • Skills on data analysis / programming / AI are added advantages.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

About this role

Summary

Manage wafer sort process development, improvement, and defect activities in a technical role

Job title

Wafersort Process Engineer (R&D Engineer Hardware)

Experience level

5+ years

Minimum experience

5+ years exp

Industry

technology

Location requirements

Malaysia-Penang (onsite), remote not specified

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

electrical engineeringelectronic engineeringwafer process knowledgebumpingdicingbackgrindtape & reelChinese languageEnglish language

Preferred skills

data analysisprogrammingAI

Specializations

wafer processprocess developmentdata analysisprogrammingAI
Locations

Structured locations inferred from the posting.

Unknown location

On-site

Unknown location

Remote