Wafer Qualification, Reliability and Failure Analysis Engineering

Broadcom Corporation

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Singapore-Senoko Singapore-Depot Road Until 8/22/2026 H-1B sponsor history First posted May 29, 2026 Last posted May 29, 2026
Job description

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Job Description:

  • Provide leadership and insights into root cause of device failures via in-depth failure analysis using intricate tools and state of the art equipment.  
  • Collaborate with product engineering and R&D team to translate findings into solutions for new design improvements.
  • Monitor and use big data analysis on long term wafer reliability performance and propose improvements to product design or manufacturing process changes.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

About this role

Summary

Lead failure analysis, collaborate on design improvements, analyze wafer reliability data.

Job title

Wafer Qualification, Reliability and Failure Analysis Engineering

Experience level

null

Industry

software

Location requirements

Singapore-based, onsite work only

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

failure analysisbig data analysisroot cause analysis

Preferred skills

None specified

Specializations

failure analysiswafer reliabilitydata analysisdevice failures
Locations

Structured locations inferred from the posting.

Unknown location

On-site

Unknown location

On-site