Test Back-End Manufacturing Engineer
CZ61 NXP Semiconductors Czech Republic s.r.o.
Apply to this job Kuala Lumpur Until 8/30/2026 H-1B sponsor history First posted July 1, 2026 Last posted July 1, 2026
Job description
Qualifications & Competencies:
•Bachelor's Degree in Engineering (Manufacturing Engineering, Electrical Engineering, Industrial Engineering, IT/computer science).
•Good command of writing and spoken in English and Bahasa Malaysia.
•Able to work as an individual as well as a good team player.
•Strong leadership, interpersonal, analytical and planning skills.
•Experienced in semiconductor manufacturing processes.
• Experience in High Volume Manufacturing Operations in Test Back-end, Post Test or Final Test will be advantageous
•Excellent MS Office tools skills.
•Posses' good knowledge in reporting/automation will be an advantage.
Job Descriptions:
•Plan and strategize daily WIP movement with manufacturing team to meet Scan Out, Pack Out, OEE and shipment targets.
•Co-ordinate and establish operational plans with Planning to expedite urgent OTD or critical lots.
•Able to establish recovery plans and improvement plan to meet TBE KPIs such as delivery outs, OTD and OEE.
•Work with manufacturing, engineering and planning to ensure inventory in WIP) are kept at optimum level. Continuous improvement in WIP management system
•Work with cross-functional teams including planner, process, maintenance, test product personnel to coordinate efforts and achieve manufacturing KPI
•Work with the IE/MFG/Maintenance/Engineering to achieve the ramp plan for new devices via tool qualification and process readiness.
•Work with the IT or reporting team to establish a comprehensive report to enable clear visualization of the TBE performance
•Review RTD and Automation to ensure optimized WIP movement and manufacturing processes.
•Take the Lead on 5S Activities for TBE Operations.
•Analyze and optimize manufacturing workflows to improve efficiency, reduce waste, and enhance product quality.
•Evaluate current production processes, identify inefficiencies and propose engineering solutions.
•Collaborate with production, quality and engineering teams to implement process enhancements and best practices through automation opportunity.
•Develop and maintain interactive Power BI dashboards to monitor manufacturing KPIs such as cycle time, OTD, output, OEE etc.
•Automate routine data reporting tasks using tools like Power Automate, Excel, and SQL.
•Automate recurring production and quality reports to reduce manual effort and human error.
•Take charge as Lead Safety Champion for TBE Operations Grp.
Behaviors
•Ownership, Right mindset and Positive behavior, willing to go extra-mile to win
•Speed of execution and focus on results.
•Data-Oriented, and ability to be analytical in terms of driving for solutions.
•Cultivates Innovation, generates creative ideas and solutions, adapts quickly to new trends and technologies.
•Collaborates, actively works with others to achieve shared goals, builds trust and resolve conflicts constructively.
#LI-633aAbout this role
Summary
Manage manufacturing workflows, optimize processes, automate reporting, lead safety, and improve KPIs.
Job title
Test Back-End Manufacturing Engineer
Experience level
none
Industry
semiconductor
Location requirements
Kuala Lumpur, on-site; remote work not specified.
Salary
Not specified
Visa sponsorship
H-1B sponsor history
Management role
No
Skills & keywords
Required skills
manufacturing processesteam coordinationreportingautomationPower BI
Preferred skills
Power AutomateSQLprocess improvement
Specializations
semiconductor manufacturingprocess optimizationautomationreportingPower BI
Locations
Structured locations inferred from the posting.
Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia
On-site City