Tape Out Engineer

CZ61 NXP Semiconductors Czech Republic s.r.o.

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Hsinchu Until 8/21/2026 H-1B sponsor history First posted May 7, 2026 Last posted May 7, 2026
Job description

Tape Out Engineer Job Description

Role Overview, Responsibilities, and Qualifications

The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes.

Key Responsibilities

  • Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing.
  • Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors.
  • Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability.
  • Ensure all deliverables conform to foundry requirements.
  • Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement.

Qualifications

  • Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred).
  • Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows.
  • Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines.
  • Willingness to work with flexible working hours to support critical Tape-outs.
  • Effective communication in English for collaborating across technical teams.

This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.


More information about NXP in Greater China...

#LI-7743
About this role

Summary

Coordinate and verify semiconductor tape out processes ensuring design integrity and manufacturability.

Job title

Tape Out Engineer

Experience level

entry level

Industry

semiconductor

Location requirements

Hsinchu, onsite, with flexible hours allowed

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

physical design toolsCadenceSynopsyssemiconductor workflowsEnglish

Preferred skills

Master's degreeproblem-solvingattention to detailworking under deadlines

Specializations

physical designsemiconductor manufacturingIC designEDA tools
Locations

Structured locations inferred from the posting.

Hsinchu, North District, Hsinchu City, Taiwan

On-site City