Sr Staff Semiconductor Process Engineer
25037.5010
Apply to this job MISSILES AND FIRE CONTROL Until 9/26/2026 First posted May 29, 2026 Last posted July 28, 2026
Job description
• Bachelors degree from an accredited college in Engineering, Physics, or related discipline.
• Experience in semiconductor packaging or FPA manufacturing in a cleanroom environment with demonstrated expertise in either flip-chip hybridization techniques or related processes, such as epoxy die attach/bonding, polishing, substrate removal, or Anti-Reflection (AR) coating or semiconductor packaging techniques.
• Must be a US Citizen, as this position is located at a facility that requires special access.
• Experience in semiconductor packaging or FPA manufacturing in a cleanroom environment with demonstrated expertise in either flip-chip hybridization techniques or related processes, such as epoxy die attach/bonding, polishing, substrate removal, or Anti-Reflection (AR) coating or semiconductor packaging techniques.
• Must be a US Citizen, as this position is located at a facility that requires special access.
About this role
Summary
Designs and improves semiconductor packaging processes in a cleanroom environment.
Job title
Sr Staff Semiconductor Process Engineer
Experience level
null
Industry
defense
Location requirements
On-site in MISSILES AND FIRE CONTROL, US citizens only
Salary
Not specified
Management role
No
Skills & keywords
Required skills
semiconductor packagingcleanroom environment
Preferred skills
None specified
Specializations
semiconductor packagingFPA manufacturingflip-chip hybridizationepoxy die attachAR coating
Locations
Structured locations inferred from the posting.
Unknown location
On-site