Sr. Product Package Solution Engineer

• Be the product package solution project leader from Package Innovation R&D team to develop the package solution for Mobile, Secure Communications, Wireless Connectivity, Power, IoT and Radar applications.
• This position is responsible for leading the packaging projects for New Product Introduction and New Technology Introduction.
• Executing the projects to ensure that all the packaging deliverables are met to support a New product introduction and time to market.
• You will coordinate activities across multiple organizations including marketing, IC design, applications, test, assembly engineering, internal and external manufacturing and you will be working with teams across multiple countries.
• Effectively coordinate and lead complex technical discussion across multiple organizations and stakeholders in NXP internal and external.
• Translating the product requirements for New product introduction in terms of package specific spec., reliability, cost.

Qualifications :

• Master’s or bachelor’s degree in Material Science, Electrical Engineering.
• Proactive working attitude and capable to handle new challenge.
• Analytically strong, drives for results, able to deal with ambiguities.
• Ambitious, energetic, result-oriented entrepreneur with a strong drive for results.
• People person and team player, very strong interpersonal skills
• Related field along with at least 10 years of experience in semiconductor IC packaging.
• Proficient risk assessment, risk mitigation and 8D skill.
• Knowledge of related package platforms such as leadframe based, laminate substrate, flip chip, and Wafer Level Chip Scale Packaging is also expected. 
• Project management experience is required.
• Fluent verbal and writing in both English and Japanese skills are required for communication with US/European teams and Japanese Customers/Suppliers.

Preferred Qualifications :

• Understanding of foundry process, assembly process, and failure analysis. 
• PMP and Six Sigma certification is preferred.
• Good coomunication in both English and Japanese languages.

More information about NXP in Japan...