SR. HBM EQUIPMENT ENGINEER

Micron Memory Taiwan Co.

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Taichung - MTB, Taiwan Until 8/22/2026 H-1B sponsor history First posted March 27, 2025 Last posted March 27, 2025
Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR61760 SR. HBM EQUIPMENT ENGINEER (Evergreen)

Job Description

• Familiar with one of the process as below and has 3 years of equipment experience at least

  • Flip chip / CoWos
  • Wafer inspect / Wafer Molding
  • Grinding/PSRG/Thinning
  • Mount/Pillar Reflow/Debond
  • Steal dicing/ laser groove/NCF lamination

• TOEIC 600 or above that available communicate with PDE/GQ global division.

• Identify, diagnose and resolve assembly equipment related problems
• Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step
• Lead / participate in continuous utilization improvement and cost reduction activities
• Validate and fan out baseline qualified, including new process, tools and/or materials for new product introduction
• Support FDC/RMS/APC/SPC
• Support site to site portability
• Manage / audit material suppliers to achieve quality, cost and risk management objectives
• Support internal and external audits

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

About this role

Summary

Diagnose and resolve equipment issues, optimize processes, and manage suppliers.

Job title

SR. HBM EQUIPMENT ENGINEER

Experience level

3+ years

Industry

technology

Location requirements

Located in Taichung, Taiwan; remote work not allowed.

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

flip chipwafer inspectgrindingTOEIC 600FDCRMSAPCSPC

Preferred skills

None specified

Specializations

equipmentprocessoptimizationqualityaudits
Locations

Structured locations inferred from the posting.

Taichung, North District, Taichung City, Taiwan

On-site City