SR. ENGINEER

Taichung City, Taichung City, Taiwan Until 8/22/2026 H-1B sponsor history First posted April 18, 2025 Last posted April 18, 2025
Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron seeks a Senior Engineer to innovate in Taiwan Taichung, developing groundbreaking wafer bonding and thinning processes.

Specific Responsibilities:

  • Assist in advanced package technology (chip stacking, 2.5D or 3D) research and development
  • Support project on-site execution and serve as a technical consultant
  • Troubleshoot complex problems, perform root cause analysis, and resolve process engineering issues
  • Drive improvements in wafer bonding and wafer thinning performance
  • Coordinate experiments for technology development and yield improvement
  • Generate internal and external documentation for presentations and technical reports

Qualifications:

  • Major in engineering science with experience in semiconductor processes, wafer bonding, and Si grinding technologies
  • Proven innovative and independent thinking capabilities
  • Exceptionally motivated great teammate
  • Proficient in communication in both English and Chinese

Contribute to innovating information usage with significant impact on advanced packaging technologies.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

About this role

Summary

Develop wafer bonding and thinning processes; troubleshoot engineering issues.

Job title

SR. ENGINEER

Experience level

3+ years

Industry

semiconductors

Location requirements

Located in Taichung City, Taiwan; remote work not allowed.

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

engineeringsemiconductor processeswafer bondingSi grindingcommunication

Preferred skills

None specified

Specializations

wafer bondingthinningsemiconductorpackaging
Locations

Structured locations inferred from the posting.

Taichung, North District, Taichung City, Taiwan

On-site City