Senior Staff Engineer Process Development (Molding)

Melaka (Malaysia) Until 8/22/2026 H-1B sponsor history First posted June 21, 2025 Last posted June 21, 2025
Job description
Will be responsible to deliver the long term encapsulation roadmap mainly focusing on encapsulation equipment and for overall IFX backend manufacturing with the inputs from package platform roadmap.

Job Description
In your new role you will:
  • Continuous exploring on new encapsulation equipment development collaboration and technical discussion with key encapsulation equipment suppliers.
  • Basic unit process equipment operation, function, mechanism and ability to define critical setup and
    conversion.
  • Basic Risk Hazardous Analysis of semiconductor packaging requirement & manufacturing safe operation environment (example ESD & Ergonomics).
  • Fundamental statistical data analysis & Statistical Process Control (example SPC).


Your Profile
You are best equipped for this task if you have:
  • Masters/Bachelor’s Degree in Engineering (Mechanical / Electrical /Electronics / Microelectronics / Mechatronics / Semiconductor Technology).
  • 8 years working experience in semiconductor manufacturing industry ( Process Engineering, Manufacturing Engineering and Package Concept / Process Development Engineering.
  • 2 years technical / functional experience in mainly in molding process (Process Engineering , Manufacturing engineering ,Package Development , Process Integration , Technology Integration) will be added advantage.
  • Fundamental analytical and problem solving skills. (example 8DMethodology, DMAIC, 5-Why Analysis).
  • Fundamental experience in statistical analysis tools (example JMP, MINITAB, CEDA, DX8).
  • Fundamental understanding of mold process and packaging material interaction.


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As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

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This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
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About this role

Summary

Deliver encapsulation roadmap focusing on equipment and manufacturing processes.

Job title

Senior Staff Engineer Process Development (Molding)

Experience level

8+ years

Industry

semiconductor

Location requirements

Located in Melaka, Malaysia; remote work not allowed.

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

engineering degreesemiconductor manufacturingmolding processanalytical skillsstatistical analysismold process

Preferred skills

None specified

Specializations

process engineeringmanufacturing engineeringpackagingstatistical analysismolding
Locations

Structured locations inferred from the posting.

Malacca, Malaysia

On-site City