Senior Staff Engineer Advanced Package Designer

Penang (Malaysia) Until 8/21/2026 H-1B sponsor history First posted July 5, 2025 Last posted July 5, 2025
Job description
-

Job Description
In your new role you will:
  • Design and develop semiconductor packages, including package layout, lead frame or/and laminate substrate design, wire bonding schemes, flip chip bump design
  • Collaborate with product engineering teams to understand product requirements and develop package designs that meet those requirements
  • Work with manufacturing teams to ensure that designed packages are manufacturable and meet production yield and quality targets
  • Develop and maintain design documentation, including package drawings, specifications, and design reports
  • Conduct design reviews and ensure that designs meet company standards and industry regulations
  • Troubleshoot package-related issues and implement design changes to resolve problems
  • Stay up-to-date with industry trends and emerging technologies in semiconductor package design
  • Collaborate with suppliers to develop and qualify new package materials and technologies
  • Develop and maintain relationships with internal stakeholders, including product engineering, manufacturing, and quality assurance teams


Your Profile
You are best equipped for this task if you have:
  • Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, or related field
  • Minimum 5 years of experience in semiconductor package design, preferably in the semiconductor industry
  • Strong knowledge of semiconductor package design principles, including package layout, lead frame design, wire bonding schemes, and flip chip bump design
  • Proficiency in CAD design tools, such as Cadence or Mentor Graphics
  • Experience with design for manufacturability (DFM) and design forte stability (DFT) principles
  • Strong analytical and problem-solving skills, with the ability to troubleshoot complex package-related issues
  • Excellent communication and collaboration skills, with the ability to work effectively with cross-functional teams
  • Strong attention to detail and ability to maintain accurate and complete design documentation


#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.

About this role

Summary

Design and develop semiconductor packages, ensuring manufacturability and quality.

Job title

Senior Staff Engineer Advanced Package Designer

Experience level

5+ years

Industry

semiconductors

Location requirements

Located in Penang, Malaysia; remote work not allowed.

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

Electrical EngineeringMechanical Engineeringsemiconductor package designCADDFMDFTcommunicationcollaborationattention to detail

Preferred skills

None specified

Specializations

semiconductorpackage designCADmanufacturabilityproblem-solving
Locations

Structured locations inferred from the posting.

George Town, Penang, Malaysia

On-site City