Semiconductor Package Competitive Analysis Intern
CZ61 NXP Semiconductors Czech Republic s.r.o.
Apply to this jobCompetitive Analysis Intern – Package Innovation
Role Summary
Support the Package Innovation (PI) team in building competitive intelligence through structured analysis of semiconductor packaging technologies, market trends, and competitor activities.
Key Responsibilities
- Perform structured data mining of competitor product releases, PCNs, teardown reports, and technology announcements
- Develop insights on packaging trends, cost/performance positioning, and technology differentiation
- Conduct startup and emerging technology evaluations relevant to advanced packaging
- Consolidate findings into clear, executive-ready reports and dashboards for PI leadership
- Maintain and enhance competitive analysis databases and tracking frameworks
Additional Exposure
- Participate in ATKL manufacturing projects to gain foundational understanding of semiconductor assembly processes
Qualifications
- Degree candidate in Materials Science, Mechanical, Electrical Engineering, or related field
- Strong analytical mindset with ability to synthesize large datasets into actionable insights
- Proficient in Excel and PowerPoint; data analysis or visualization experience preferred
- Familiarity with AI tools and advanced search techniques for efficient data mining is highly desired
- Strong communication skills with ability to clearly present findings
Summary
Assist analysis of semiconductor packaging technologies, trends, and competitor activities.
Job title
Semiconductor Package Competitive Analysis Intern
Experience level
student or entry level
Industry
semiconductor
Location requirements
Kuala Lumpur, remote work not specified
Salary
Not specified
Visa sponsorship
H-1B sponsor history
Management role
No
Required skills
Preferred skills
Specializations
Structured locations inferred from the posting.
Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia