Semiconductor Operations - Advanced SiP Packaging

Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there is no telling what you could accomplish. The people here at Apple do not just create products - they create the kind of wonder that is revolutionizing entire industries. It is the diversity of those people and their ideas that inspires the innovation that runs through everything we do. Join Apple, and help us leave the world better than we found it.

Description

The Apple Semiconductor Operations team is looking for a motivated, highly technical Component SiP productization engineering focusing on product and process development, supplier readiness, and high-volume manufacturing quality.
This role will drive NPI execution, process bring-up, qualification readiness, and quality improvement for advanced SiP, RF, antenna, mmWave, wireless, and high-density module technologies.
The successful candidate will work with module integration suppliers, OSATs, sub-component vendors, PCB/substrate suppliers, and system integration sites. They will interface regularly with Engineering, Operations, Reliability, and Quality teams.

Minimum Qualifications

Strong SiP, semiconductor packaging, module assembly, or advanced packaging experience, including knowledge of assembly processes, materials, substrates, and package-level failure mechanisms.
5+ years relevant experience in product engineering, process engineering, semiconductor packaging, module productization, supplier quality, or high-volume manufacturing.
MS/BS in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or related technical discipline
Understanding of SPC, DOE, FMEA, JMP or equivalent data analysis tools, and factory quality metrics used to monitor production performance.
Strong understanding of reliability testing and failure mechanisms such as temperature cycling, board-level reliability, MSL, bHAST, CAF, warpage, solder fatigue, and substrate/material interactions.
Strong interpersonal skills to work with design, development, operations, reliability, quality, supplier engineering, and other cross-functional teams.

Preferred Qualifications

Hands-on experience with supplier manufacturing process control, quality systems, factory audits, and production readiness reviews.
Ability to take advanced packages or modules from concept and development builds to high-volume manufacturing.
Experience with RF, mmWave, antenna module, wireless module, high-density package, or advanced SiP architecture is a plus.
Ability to communicate technical risk clearly, drive issue closure, and provide concise executive-level updates.
Self-motivated, good communicator, and able to lead complex issues across global suppliers.