Semiconductor Assembler

CZ61 NXP Semiconductors Czech Republic s.r.o.

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Kuala Lumpur Until 8/22/2026 H-1B sponsor history First posted March 27, 2025 Last posted March 27, 2025
Job description

Description

  • Perform a variety of functions in the production of semiconductor devices such as wafer fabrication, assembly, test and/or probe.
  • Operates appropriate machines/equipment in produce output according to specifications and procedures.

 

Qualifications

  • Able to work independently
  • Preferably 1 year of working experience in semi-conductor or electronic industry

#LI-DNI

About this role

Summary

Perform functions in semiconductor production including fabrication, assembly, and testing.

Job title

Semiconductor Assembler

Experience level

1 year

Industry

electronics

Location requirements

Located in Kuala Lumpur, remote work not allowed

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

work independently

Preferred skills

None specified

Specializations

semiconductorwafer fabricationassemblytestprobe
Locations

Structured locations inferred from the posting.

Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia

On-site City