R&D Process Engineer, Advanced Bonding Process Development

Diamond Foundry

Bay Area, California on site Until 8/26/2026 H-1B sponsor history First posted June 27, 2026 Last posted June 27, 2026

Job description

Diamond Foundry Inc. is solving the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless. We have managed to produce the world's first single-crystal diamond wafers and are now on a mission to put a diamond behind every chip. We are the rare unicorn that has grown fast and profitably. We received $515m in funding and are executing a multi-$B expansion plan for one of the greenest forms of tech manufacturing: converting greenhouse gas into diamond wafers using zero-emission energy.

We are seeking an on-site R&D Process Engineer to join our AI Chips team. This role will support customer prototyping and internal process development for advanced packaging applications, with a focus on integrating single-crystal diamond with AI customer devices to demonstrate thermal and performance benefits.

The ideal candidate is a hands-on process engineer with strong technical problem-solving skills, a collaborative mindset, and the ability to support fast-paced customer and internal development programs.

This position will be located in our San Jose office.

Responsibilities

Support customer prototyping projects to integrate single-crystal diamond with customer devices and demonstrate thermal and performance benefits.

Develop advanced packaging and bonding processes adaptable to diverse customer device designs, material stacks, package configurations, and integration requirements.

Evaluate, select, and optimize bonding technologies, including pressure/pressureless sintering, thermocompression, surface/plasma-activated bonding, and emerging methods.

Drive internal process development and validation, including cleaning, metallization, DOE-based bonding optimizations, process characterization, failure analysis, and reliability testing.

Manage end-to-end project execution, covering schedules, technical risks, cross-functional communication, customer updates, and technical reports.

Requirements

Bachelor’s or advanced degree in materials science, electrical engineering, chemical engineering, or a related field.

Experience in semiconductor packaging, advanced materials, process engineering, device integration, or related technical development is preferred.

Familiarity with bonding, thin-film deposition, surface preparation, metrology, failure analysis, reliability testing, or similar process technologies is desirable.

Strong problem-solving skills and willingness to learn new materials, tools, and processes.

Good communication skills and ability to work effectively with cross-functional teams, hands-on, detail-oriented, motivated, and comfortable working in a fast-paced development environment.

Diamond Foundry believes in supporting our employees from the workplace to their personal and home life. We provide eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work. Perks include employee discounts to VRAI. Our benefits begin as early as your first day of employment. Medical and vision coverage are retroactive to your start date, while dental and voluntary benefits take effect once you’ve completed your enrollment.

Diamond Foundry is an Equal Opportunity Employer and considers qualified applicants for employment without regard to race, color, creed, religion, national origin, sex, sexual orientation, gender identity and expression, age, disability, veteran status, or any other protected factor under federal, state or local law.

Diamond Foundry Inc. is committed to operating in full compliance with all applicable state and federal laws. Our commitment extends to ensuring that our manufacturing and engineering departments adhere to the highest standards of legal and regulatory compliance. Additionally, these departments may have specific physical requirements to ensure the safety and efficiency of our operations. We prioritize the well-being of our employees and strive to create a work environment that promotes both legal compliance and the optimal functioning of our manufacturing and engineering processes.

Manufacturing and Engineering Departments Physical Requirements:

-Use appropriate PPE and follow all safety policies, practices, and procedures.

-This position will often: Sit, stand for long periods, walk, grasp, reach with hands and arms, lift below and above shoulders, bend, twist at the waist, climb, balance, stoop, squat, kneel, crawl, talk, hear, see, use fine finger manipulation, and complete repetitive motions.

-Some tasks may require the use of ladders or stairs

-Some tasks may require driving or the use of foot controls

-Lift/carry and push/pull up to 50 pound

This employer participates in E-Verify and will provide the federal government with your Form I-9 information to confirm that you are authorized to work in the U.S.

If E-Verify cannot confirm that you are authorized to work, this employer is required to give you written instructions and an opportunity to contact Department of Homeland Security (DHS) or Social Security Administration (SSA) so you can begin to resolve the issue before the employer can take any action against you, including terminating your employment.

Employers can only use E-Verify once you have accepted a job offer and completed the Form I-9.

Compensation (from employer):
125000–145000 USD per year

About this role

Summary

Support process development and customer projects for advanced bonding and packaging.

Job title

R&D Process Engineer, Advanced Bonding Process Development

Experience level

none

Industry

manufacturing

Location requirements

On-site in San Jose, California; no remote work allowed.

Salary

$125k–$145k

Visa sponsorship

H-1B sponsor history

Management role

Skills & keywords

Required skills

materials sciencesemiconductorbondingmetrology

Preferred skills

failure analysisreliability testingsurface preparation

Specializations

bondingmaterialssemiconductor packagingprocess developmentfailure analysis

Locations

Structured locations inferred from the posting.

San Jose, CA, USA

On-site City