Process Sustaining Manager (Die Attach/DACA Engineering)
GB62 Nexperia United Kingdom
Apply to this jobProcess Sustaining Manager (Die Attach/DACA Engineering)
Job Summary
Lead the Process Engineering team responsible for sustaining Die Attach manufacturing processes to achieve world-class yield, quality, productivity and cost performance.
What you need to do
- Lead Process Engineers.
- Own process yield and quality performance.
- Drive defect reduction initiatives.
- Lead DOE, SPC and Process Capability improvement.
- Support NPI and customer qualification.
- Improve cycle time and productivity.
- Lead cross-functional problem solving.
- Maintain process documentation and controls.
- Mentor engineering team.
What you need to have
- Bachelor's/Master's Degree in Engineering.
- 8–10 years semiconductor assembly experience.
- Strong Die Attach process knowledge.
- Experience in Six Sigma, DOE, SPC and FMEA.
- Leadership experience preferred.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.
Summary
Lead process engineering for die attach manufacturing; improve yield, quality, and productivity.
Job title
Process Sustaining Manager (Die Attach/DACA Engineering)
Experience level
8–10 years
Minimum experience
8+ years exp
Industry
semiconductors
Location requirements
Seremban, no remote work allowed
Salary
Not specified
Visa sponsorship
H-1B sponsor history
Management role
Yes
Required skills
Preferred skills
Specializations
Structured locations inferred from the posting.
Seremban, Negeri Sembilan, Malaysia