Process Engineer

Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the process development of New Product Introduction, architecting new concepts and defining process flows to ensuring successful high-volume manufacturing with external OSAT partners. You will work at the intersection of design, materials science, and manufacturing, collaborating with internal cross-functional teams and external suppliers to solve complex integration challenges and successfully bring next-generation sensing technologies to market. This position requires a candidate with a proven track record of shipping products, deep technical expertise in assembly processes, and strong leadership skills.

Description

Apple’s ATG Sensing Group is looking for a senior level electronic packaging engineer to work on developing exciting new products. This role will be responsible for providing module packaging solutions to be integrated in systems for consumer markets. This role will be working with internal device design, product design, operation, as well as external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are innovative as well as experienced in a high volume manufacturing environment.

A successful candidate should have a proven track record of successfully shipped products with 3rd party manufacturing partners. Candidate must demonstrate the ability to lead cross functional teams to success. Candidate should be experienced with operating independently as well as collaboratively in a complex multi-disciplinary development program.

Minimum Qualifications

BS and 10 +years of relevant industry experience.

Preferred Qualifications

Understand and keep up-to-date with industry landscape on relevant technologies.
Strong interpersonal and team-building skills.
Proven track record of work with OSAT to bring up a product from conceptual to MP stage.
Strong materials science and failure analysis (FA) knowledge related to assembly chip-packaging interactions and reliability failures.
Proficient in applying DOE vs. Hypothesis tool for root cause analysis.
Excellent written and verbal communication skills.
In-depth knowledge in the area of semiconductor sensor packaging technologies.
Expert-level knowledge in assembly steps: wafer thinning, wafer dicing, die attach (including flip chip and multi-die stacking), wirebond, encapsulation and underfill, SMT, transfer/compression molding, singulation, and wafer level packaging processes.
Working level knowledge in wafer bumping, RDL, and TSV.
Experience in using simulation to guide process setup.
Experience in using AI to support process development.
Experience in capacitive sensing module packaging.
Experience in customer facing cosmetic packaging.