Process and Equipment Tech
CZ61 NXP Semiconductors Czech Republic s.r.o.
Apply to this jobPlating Process Technician
Carryout the following activities
Set up Plating Line as process specification Setting up recipes based on product requirement Set up and maintenance of plating baths and miscellaneous related equipment related to electroplating Responsible for chemical addition based on lab analysis Chemical Filtration & Leaching activity Anode Top Up for respective plating lines
Requirement:
1) Diploma in Engineering (Chemical, Mechanical) or related
2) Previous experience in electroplating in semiconductor assembly
Plating Equipment Technician
Carryout the following activities
Set up Plating Line Loader and Unloader Change Over of Loader and Unloader Carryout periodical maintenance for plating machine Maintenance of plating machine fittings Replacement of Plating Pumps and Rectifiers Serving Pumps and Blowers
Requirement:
1) Diploma in Engineering (Electric/ Electronic, Mechanical) or related
2) Previous experience in electroplating in semiconductor assembly
#LI-DNI
Summary
Set up and maintain plating lines and equipment for electroplating.
Job title
Process and Equipment Tech
Experience level
2+ years
Industry
manufacturing
Location requirements
Located in Kuala Lumpur, remote work not allowed
Salary
Not specified
Visa sponsorship
H-1B sponsor history
Management role
No
Required skills
Preferred skills
Specializations
Structured locations inferred from the posting.
Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia