Principal Engineer Unit Process Development Die Attach

Responsible for Die Attach processes (Development – Manufacturing overarching) with a focus on High Performance Die Attach such as Sintering & Diffusion Solder.

Job Description
In your new role you will:

• Responsible for working with all innovation, package development & production (EU, Asia Sites) to develop and maintain long term Unit Process Roadmap (process, equipment, material) to provide fast T2M and minimize complexity in development and manufacturing.
• Support & Govern Platform Unit Process Development, apply technical skills and bring this into the A projects to support critical issues and agreements.
• Strategy papers: develop Long term, up-to-date strategies for unit processes (Die Attach process). Ensure clear strategy aligned across BE, identify white spots and derive respective actions/projects out of it to close gaps.
• Governance for Process Block Catalog (PBC), technical expert to Technical Process Chain (TPC): Key unit processes described clearly by PBC. Ensure strict adherence to Process Block Catalog and Technology, Material & Equipment Roadmap.
• Design to Cost with focus on key equipment Suppliers. Develop Strategic/long term partnerships with key suppliers. Target to have -30% invest per Piece out on every new Equipment on Roadmap.

Your Profile
You are best equipped for this task if you have:

• Degree/Master/PhD in Mechanical/Material Engineering / Science or related disciplines.
• More than 10 years of experience in semiconductor industry.
• Specialist in unit process development especially for Die Attach processes (adhesive, film, soldering, sintering, diffusion solder, preform, printing, surface mount etc)
• Experience working in a multinational organization and leading a team to implement in cross-functional organization.
• Good knowledge in R&D in semiconductor field, technology road mapping and realization.
• Good overview of competitor and industry trend.

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