Principal Engineer Package Development

We are seeking a highly skilled and experienced Package Development Engineer to provide technical support for new product introduction at subcons. The successful candidate will be responsible for ensuring that technical, quality, schedule, and cost requirements are achieved, and that the project meets customer requirements in terms of timeline, cost, and quality.

Job Description
In your new role you will:

• Provide technical support for new product introduction at subcons, ensuring that technical, quality, schedule, and cost requirements are achieved
• Responsible for technical support of new product/package/new process development
• Ensure that the project meets customer requirements in terms of timeline, cost, and quality.
• Assess and mitigate technical risks.
• Provide design proposal for package, lead frame, substrate, and Cu-clip of new products.
• Close interaction with the project manager, subcon interface, chip designer, application team, marketing, and business units for new product design and project roadmaps.
• Provide technical direction related to problem-solving of process and reliability issues.
• Closure of Package Development related deliverables and documents.
• Technical Documentation through Delta analysis, DFMEA, PFMEA, Process Flow, and Control plan.

Your Profile
You are best equipped for this task if you have:

• Master/Bachelor Degree in Engineering and Physical Science.
• Minimum 5 years of experience in Package/Process development in Semiconductor packaging.
• Experience in semiconductor package development.
• Analytical and self-driven.
• Experience in analytical tools: Delta Analysis, DFMEA, DoE, 8D, and simulation.
• Proficient in AutoCAD for 2D drawing. Knowledge using 3D software (e.g., AutoCAD 3D, Inventor, and SolidWorks) is an advantage.
• Exposure to the development of a wide variety of packages: TO, QFN, CuClip, Flip Chip, SOIC, QFP.
• Knowledge in package design rules.
• Proficient in industry standards for package reliability test and qualifications.
• Knowledge of FA techniques.
• Knowledgeable on assembly processes.
• Can interpret package simulation results. Knowledge in package simulation software (e.g., ANSYS, SolidWorks) for FEA & thermal analysis is an advantage.
• Excellent in statistical analysis that can provide a clear direction based on package/process DOE.
• Working knowledge of DFMEA during design phase and ability to create a strategy to mitigate risk.
• Knowledge in IP management and patent filing.

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