Plating Process Engineer

STMicroelectronics

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Calamba, Philippines Until 10/7/2026 H-1B sponsor history First posted August 8, 2026 Last posted August 8, 2026
Job description

OUR STORY


At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.


When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.


Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo,  drive innovation, and unlock their own potential. 

Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

We are seeking an experienced and highly motivated Senior Process Engineer to lead and support our Plating and Backetch processes. In this role, you will be responsible for process ownership, capability improvement, technical troubleshooting, and cross-functional coordination to ensure safe, efficient, and high-quality manufacturing operations.

This position plays a key role in driving process optimization, resolving complex technical issues, supporting technology transfers and new product introductions, and mentoring junior engineers and technicians.

Key Responsibilities

  • Own and optimize the plating, waterjet, backetch processes to achieve safety, quality, delivery, and cost targets.
  • Lead troubleshooting and root cause analysis for yield loss, process excursions, defects, and equipment-related issues.
  • Define, review, and improve process recipes, operating windows, and control plans.
  • Analyze process data, identify trends, and implement corrective and preventive actions to improve process capability and stability.
  • Drive continuous improvement initiatives to reduce defects, cycle time, chemical consumption, and operational cost.
  • Support process qualification, validation, and change management for new materials, equipment, and product introductions.
  • Collaborate closely with Production, Quality, Maintenance, Equipment Engineering, and EHS teams to resolve issues and implement improvements.
  • Ensure compliance with company standards, environmental regulations, and safety requirements.
  • Develop and maintain process documentation, specifications, work instructions, and technical reports.
  • Provide technical leadership and mentorship to junior engineers and technicians.
  • Support capacity expansion, equipment upgrades, and improvement projects related to plating and backetch operations.

 

Required Qualifications

  • Bachelor’s degree or higher in Chemical EngineeringChemistry, or a related field.
  • Strong experience in process engineering within manufacturing, preferably in tin platingwet chemicaletching, or similar high-precision processes.
  • Proven ability to troubleshoot complex process issues and lead structured root cause analysis.
  • Strong understanding of process control, statistical analysis, and process capability improvement.
  • Excellent communication, coordination, and documentation skills.
  • Ability to work effectively across multiple functions and manage technical priorities.
  • Proficiency in data analysis tools and Microsoft Excel.

Preferred Qualifications

  • Semiconductor manufacturing experience in tin plating and/or backetch processes.
  • Prior experience in technology transfer, process qualification, or manufacturing ramp-up activities.
  • Familiarity with SPCDOEFMEA8D5 Why, and similar engineering tools.
  • Knowledge of chemical process safety, bath control, contamination control, and equipment optimization.
  • Experience mentoring engineers or leading technical initiatives within a manufacturing team.

 

 

Key Competencies

  • Technical leadership
  • Process ownership
  • Advanced problem solving
  • Data-driven decision making
  • Cross-functional collaboration
  • Continuous improvement mindset
  • Mentorship and coaching
  • Accountability and ownership

ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture. 


To discover more, visit st.com/careers.

About this role

Summary

Manage and optimize plating and backetch processes, troubleshoot issues, drive improvements, and mentor team.

Job title

Plating Process Engineer

Experience level

senior level

Industry

semiconductor

Location requirements

Calamba, Philippines, on-site work only

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

process troubleshootingprocess controlstatistical analysisprocess documentationcross-functional collaboration

Preferred skills

tin platingbacketchSPCDOEFMEA8D5 Whyprocess qualification

Specializations

platingwet chemicaletchingprocess controlchemical safety
Locations

Structured locations inferred from the posting.

Calamba, 4027 Laguna, Philippines

On-site City