Physical Design Engineer

Broadcom Corporation

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US-CA San Jose Innovation Drive Until 10/7/2026 10+ years exp H-1B sponsor history First posted August 8, 2026 Last posted August 8, 2026
Job description

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Job Description:

The ASIC Products Division at Broadcom has developed some of the most complex IC solutions and technologies over the last two decades. Our products power the internet in areas such as machine learning, cloud computing, wireless infrastructure, and networking. We develop some of the most advanced technologies in the industry encompassing 3D and 2.5D interconnects.

We are seeking a design engineer with physical layout skills to develop our next generation products with a focus on parallel interfaces. The job requires aspects of a successful layout engineer, an electrical background, a strong interest in 2.5D and 3D IC development, and new technology pathfinding. The candidate will work on a mix of customer products and development of new interconnect technologies and IP for MCM, 2.5D, and 3D ICs, working alongside R&D, IP development, customers, and manufacturing partners.

This is an exciting opportunity to develop new ideas, design the next generation of leading edge ASIC products, and work on the most advanced technologies in the industry.

Responsibilities:

  • Design implementation and physical layout implementation of power grids, 2.5D and 3D die-die interconnects.

  • DRC, LVS, and electrical checking.

  • Ability to automate common processes and design steps.

  • Development of high-speed signal interconnects working alongside SI and PI engineers.

  • Electrical analysis and optimization of ubump and RDL patterns.

  • Evaluation and development of new 2.5D and 3D interconnect technologies.

  • Technology and testchip roadmapping with a focus on advanced packaging.


Skills and Experience:

  • Independent, self-starter who can work across a worldwide organization and customer base.

  • Ability to manage multiple concurrent customers under short timelines.

  • Comfort with providing guidance and direction with incomplete information.

  • Experience with various IC, Package and PCB layout databases and tools.

  • Strong TCL, Python scripting experience to automate routine tasks.

  • Bachelor's degree in Electrical Engineering or Computer Science and 12+ years related work experience; or a Master's degree in Electrical Engineering or Computer Science and 10+ years related work experience.


Compensation and Benefits


The annual base salary range for this position is USD 143,800.00 To USD 230,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.


Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.


Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.


If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

About this role

Summary

Designs physical layout, interconnects, and optimizes high-speed signals for advanced ASICs.

Job title

Physical Design Engineer

Experience level

12+ years or 10+ years with master's degree

Minimum experience

10+ years exp

Industry

technology

Location requirements

San Jose, CA; remote not specified

Salary

$144k–$230k

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

tclpythonelectrical engineeringIC layoutpower grids

Preferred skills

None specified

Specializations

physical layoutinterconnectsIC design3D IC2.5D IC
Locations

Structured locations inferred from the posting.

San Jose, CA, USA

On-site City