PD - IP Lead – Sr Staff, Physical Design
Eliyan
Apply to this job Bay Area on site Until 8/23/2026 H-1B sponsor history First posted April 21, 2026 Last posted April 21, 2026
Job description
Join the leading chiplet startup! As an Eliyan Sr Staff / Principal Physical Design Engineer, you will be working at a fast-paced early-stage startup creating technologies that fuel tomorrow’s chiplet based systems with best-in-class power, area, manufacturability, and design flexibility. You will drive the development of cutting-edge ASICs from RTL to GDSII. You will work with a cross-functional team of industry experts that operate from first principles, innovate, and push the envelope to create high-volume and high-performance manufacturable products. In this role, you will oversee and optimize the entire design flow, including synthesis, place-and-route (PNR), static timing analysis (STA), electromigration/IR drop analysis (EM/IR), and physical verification (PV – DRC, LVS, Antenna). You will also focus on developing and improving design flows and methodologies to ensure high-quality, on-time delivery. We offer a fun work environment with excellent benefits.
Responsibilities:
- Define and execute IP block and partition physical design strategy across projects, aligning schedules, resources, and milestones to company tapeout goals.
- Lead mixed signal placement and routing, enforcing analog keepouts, shielding, and DRC aware methodologies while integrating digital logic cleanly.
- Own system and block integration for floorplanning, power, placement, CTS, and constraints, ensuring consistent interfaces across hierarchy and reuse
- Drive end to end IP physical implementation from RTL handoff through GDSII, managing iterations, ECOs, and closure plans across corners
- Develop and maintain block specific flow customizations for synthesis, PNR, EM IR, STA, and physical verification to improve QoR and predictability
- Deliver robust constraints methodology, pushing timing intent from system to block and back, maintaining mode and corner correctness for signoff
- Run and close subsystem signoff including STA, EM IR, SI, DRC, LVS, antenna, and metal fill, meeting reliability and manufacturability requirements
- Optimize clock architecture and CTS for skew, latency, and power, including skew group definitions and balancing across library corners
- Collaborate with front end, DFT, packaging, and manufacturing to resolve integration risks, test mode impacts, and physical interface requirements
- Provide clear status, risk, and mitigation reporting to leadership, using metrics driven dashboards for PPA, convergence, and schedule predictability
Minimum Qualifications:
- Expertise in physical design, timing closure, and signoff for small to large ASIC IP blocks, including mixed signal integration and subsystem closure ownership
- Strong hands-on experience with floorplanning, power planning, placement, CTS, routing, EM IR, STA, and PV signoff across MMMC scenarios
- Proven ability to improve flows through automation and scripting, with disciplined debug skills and data driven QoR and runtime optimization mindset
- Excellent cross functional leadership and communication skills to drive alignment, technical reviews, and closure decisions under aggressive timelines
About this role
Summary
Lead physical design, optimize flows, ensure signoff, collaborate across teams, deliver high-performance ASICs.
Job title
Physical Design Engineer
Experience level
not specified
Industry
semiconductors
Location requirements
Bay Area, remote work not specified
Salary
Not specified
Visa sponsorship
H-1B sponsor history
Management role
Yes
Skills & keywords
Required skills
physical designtiming closuresignofffloorplanningpower planningplacementCTSroutingEM IRSTAPV
Preferred skills
automationscriptingsignoffEDA tools
Specializations
ASICphysical designtiming closuresignoffmixed signal
Locations
Structured locations inferred from the posting.
Unknown location
On-site