Packaging Architect Design Engineer

Broadcom Corporation

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US-CA Irvine Alton Parkway Bldg 2 Until 8/21/2026 2+ years exp H-1B sponsor history First posted April 10, 2026 Last posted April 10, 2026
Job description

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Job Description:

Hiring a talent in advanced packaging design with intensive hands-on experience in GDSII-based physical layout and in-depth knowledge in advanced 2.5D/3D packaging architect and technology. Skills in .mcm-based layout is a plus.

The job scope includes:

(1) Architect advanced packaging solution to meet future product requirements

(2) Define design rules for the new technology

(3) Design (with physical layout) test vehicles to support technology development

(4) Generation of design collaterals for new technology introduction

(5) Drive design-for-yield and design-for-cost activities after a new technology is in production

Education/Experience

Bachelor's degree in Engineering and 2+ years of related experience or Masters degree in Engineering and No years of related experience


Compensation and Benefits


The annual base salary range for this position is USD 74,000.00 To USD 118,800.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.


Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.


Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.


If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

About this role

Summary

Designs advanced packaging solutions, defines design rules, and supports technology development.

Job title

Packaging Architect Design Engineer

Experience level

2+ years

Minimum experience

2+ years exp

Industry

semiconductors

Location requirements

Irvine, California, on-site; remote not specified.

Salary

$74k–$119k

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

GDSIIphysical layout2.5D/3D packagingdesign rules

Preferred skills

.mcm-based layout

Specializations

packaging designphysical layoutGDSII2.5D/3D packagingdesign rules
Locations

Structured locations inferred from the posting.

Irvine, CA, USA

On-site City