Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging
Amazon
Apply to this job US, AZ, TempeUSA, TX, AustinUSA, CA, Cupertino Until 10/7/2026 First posted August 8, 2026 Last posted August 8, 2026
About this role
Summary
Designs package layouts for AI silicon products, focusing on packaging and integration.
Job title
Package Layout Design Engineer
Experience level
null
Industry
technology
Location requirements
must be in USA, remote work not specified
Salary
Not specified
Management role
No
Skills & keywords
Required skills
packaging designsilicon packagingAI hardware
Preferred skills
None specified
Specializations
packaging designsilicon packagingAI hardware
Locations
Structured locations inferred from the posting.
Unknown location
Work arrangement unknown
Unknown location
Work arrangement unknown
Unknown location
Work arrangement unknown