<New Graduate Hiring> Marking Process Engineer
CZ61 NXP Semiconductors Czech Republic s.r.o.
Apply to this job Kaohsiung Until 9/18/2026 H-1B sponsor history First posted July 20, 2026 Last posted July 20, 2026
Job description
Responsibilities:
•Process engineer include Molding and Laser Marking process. Well-known Assembly front-end & back-end process is preferred.
•Focus on process maintenance and improvement, new technology development, and continues yield improvement.
•Collaboration with related departments including internal or external.
Qualifications:
•Bachelor or Master's degree, major in Mechanical or Material Engineering or other related disciplines
•Seniority less than 2 years.
•Ability to speak and write in English fluently.
•Good communication (Chinese and English) and emotion management..
•Learning, innovation, fast-paced, and teamwork.
#LI-2370About this role
Summary
Maintain and improve manufacturing processes, develop new technologies, collaborate across departments.
Job title
Marking Process Engineer
Experience level
less than 2 years
Industry
electronics
Location requirements
Kaohsiung, no remote work allowed
Salary
Not specified
Visa sponsorship
H-1B sponsor history
Management role
No
Skills & keywords
Required skills
English fluencycommunication
Preferred skills
assemblyprocess optimization
Specializations
moldinglaser markingassemblyprocess maintenanceprocess improvement
Locations
Structured locations inferred from the posting.
Kaohsiung, Gushan District, Kaohsiung City, Taiwan
On-site City