NAND Product Development Engineer

Join a multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry. Headquartered in Rancho Cordova, California, Solidigm combines elements of an established, successful technology company with the spirit, agility, and entrepreneurial mindset of a start-up. In addition to the U.S. headquarters and other facilities in the U.S., the company has international presence in Asia, Europe, and the Americas. Solidigm will continue to lead the world in innovating new Memory technologies with aspirations to be the #1 NAND memory company in the world. At Solidigm, we view problems as opportunities to define innovative solutions that hold the power to change the world and unleash the potential technological needs that the future holds. At Solidigm, we are One Team that fosters a diverse, equitable, and inclusive culture that embraces individual uniqueness and empowers us to bring our best selves to deliver excellence in support of Solidigm's vision and mission to be the go-to partner for optimized data storage solutions. You can be part of the takeoff of an innovative business that develops cutting-edge products, delivers strong business value for customers, provides an engaging workplace for its employees, and serves a greater impact on the world. This is a golden opportunity for the right applicant to join us and help design, build, and lead Solidigm. We want a diverse team of dedicated professionals who will not just be Solidigm team members but contribute to how we shape the future of the organization. We are seeking applicants who will grow and thrive in our culture; be customer inspired, trusting, innovative, team-oriented, inclusive, results driven, collaborative, passionate, and flexible.

Experienced engineer familiar with NAND component test, will responsible for new generation NAND production introduction, setup component test strategy to support product qualification. lead yield improvement during NPI and HVM sustaining.

Major responsibilities include:

1） Develop, validate, and deploy burn‑in and high‑speed I/O test specifications, methodologies, and test flows for NAND flash components across high‑volume manufacturing platforms.

2） Partner closely with test development engineers to ensure robust assessment of test code validation plan, check out data review and tape release plan.

3) Communicate key component test information with cross‑functional stakeholders including yield roadmap/projection, test coverage etc

4) Analyze component test and manufacturing data to identify yield trends, anomalies, and opportunities for product, process, or test improvement.

5)  Collaborate with design, process, and reliability teams to troubleshoot complex test issue and optimize test methodologies to improve coverage, efficiency, and cycle time while supporting yield enhancement and failure analysis activities.

Minimum Qualifications:

1) Master’s degree in Electrical/Electronic Engineering, Computer Engineering, Semiconductor Circuit Design, or related fields.

2) 5+ years of experience in logic/memory product engineering or test engineering. Proficient in statistical data analysis and electrical failure analysis to segment and determine root cause of test failures.

3) Knowledge of NAND Flash memory technology, including architecture and operation.

4) Functional knowledge of burn-in and high speed I/O test platforms and architectures.

5) Excellent communication and teamwork abilities, with experience working in a multi-disciplinary engineering environment.

6) Proven track record of technical leadership and ability to work independently.

Preferred Qualifications:

10+ years of experience in memory product/test engineering, with majority of it in NAND Flash.

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Compensation (from employer):
320400 – 452300 CNY (YEARLY)