MATERIAL ENGINEER, ADVANCED PACKAGING TECHNOLOGY DEVELOPMENT

Micron Memory Taiwan Co.

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Taichung - Fab 16, Taiwan Until 8/21/2026 H-1B sponsor history First posted May 16, 2026 Last posted May 16, 2026
Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

• Identify, diagnose and resolve assembly material related problems
• Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step
• Lead / participate in continuous yield improvement and cost reduction activities
• Validate and fan out new material qualified, including new process and/or tools for new product introduction
• Support SPC/FDC/RMS/APC
• Support site to site portability
• Manage / audit material suppliers to achieve quality, cost and risk management objectives
• Support internal and external audits

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.   

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

About this role

Summary

Identify and resolve assembly materials problems, optimize processes, support quality and cost targets.

Job title

MATERIAL ENGINEER, ADVANCED PACKAGING TECHNOLOGY DEVELOPMENT

Experience level

not specified

Industry

technology

Location requirements

Taiwan-based, remote not specified

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

material evaluationprocess optimizationSPCFDCRMS

Preferred skills

None specified

Specializations

materialspackagingprocessqualityyield
Locations

Structured locations inferred from the posting.

Unknown location

Work arrangement unknown