Lead Principal Engineer Package Technology

Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc) activities for package projects with major changes/new package, risks and impact.

Job Description
In your new role you will:

• Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed.
• Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements.
• Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3).
• Contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how.
• Support pre development & project definition stage, and continue to be package design expert throughout project phase.
• Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons.

Your Profile
You are best equipped for this task if you have:

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
• 10 years of relevant working experience in IC/semiconductor environment.
• Semiconductor Packaging, Assembly and Test.
• Process and Equipment Engineering knowledge.
• Failure Analysis and Reliability Engineering.
• Analytical and Problem Solving Skills.

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