Lead Engineer, Fab Technologies

Entegris, Inc.

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Hsinchu City, Taiwan Until 9/13/2026 8+ years exp H-1B sponsor history First posted July 15, 2026 Last posted July 15, 2026
Job description

Job Title:

Lead Engineer, Fab Technologies

Job Description:

[The Role] Entegris is seeking a Lead Fab Technology Engineer for Surface Preparation and Integration (SPI) based in Taiwan to play a pivotal role in solving our customers' most challenging problems and identifying new opportunities in Selective Wet Etch and Clean area. This position will be at the forefront of customer adoption progression of existing and new products, providing technical leadership during launches and commercialization efforts for Entegris' SPI Material Solutions Business Unit. [In this role you will] Serve as the technical expert for Selective Wet Etch & Clean solutions, providing application support and leading customer evaluations, qualifications, and technical discussions. Drive business growth by identifying, developing, and converting customer opportunities while supporting SPI revenue goals in Taiwan. Build strong relationships with customers, account teams, and key OEM partners to develop new business opportunities and support long-term growth. Collaborate with Business Units, R&D, Supply Chain, and Quality teams to align product roadmap, operations, and customer requirements. Represent the region in business reviews, customer roadmap discussions, and global opportunity reviews. Deliver technical training and market insights to customers and internal stakeholders. Support customer engagement activities through domestic and international travel (up to 30%). [Traits we believe make a strong candidate] Bachelor’s, Master’s, or PhD degree in Chemistry, Chemical Engineering, Materials Science, or a related Engineering discipline. 8–10+ years of experience in Wet Etch & Clean processes within semiconductor manufacturing, equipment, or materials suppliers. Strong expertise in process development for advanced semiconductor technologies (Logic, Memory, or 3D architectures); experience with semiconductor equipment suppliers is preferred. Experience with surface analytical and characterization techniques is a plus. Strong analytical problem-solving, communication, and presentation skills, with the ability to work independently and collaboratively in a fast-paced environment. Fluent in English for technical discussions and customer presentations (TOEIC 600+ preferred). Sales, customer-facing, or people management experience is a plus. Based in Hsinchu or nearby areas, with flexibility to travel as required.

About this role

Summary

Lead technical support and development for wet etch and clean in semiconductor fabrication.

Job title

Lead Engineer, Fab Technologies

Experience level

8+ years

Minimum experience

8+ years exp

Industry

technology

Location requirements

Hsinchu City, Taiwan; remote work not specified.

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

process developmentsemiconductor manufacturingcustomer supportanalytical techniques

Preferred skills

surface analysiscustomer engagementsales experienceteam collaboration

Specializations

surface preparationwet etchclean processessemiconductor
Locations

Structured locations inferred from the posting.

Hsinchu, North District, Hsinchu City, Taiwan

Work arrangement unknown City