Lead Engineer, Fab Technologies
Entegris, Inc.
Apply to this job Hsinchu City, Taiwan Until 9/13/2026 8+ years exp H-1B sponsor history First posted July 15, 2026 Last posted July 15, 2026
Job description
Job Title:
Lead Engineer, Fab TechnologiesJob Description:
[The Role] Entegris is seeking a Lead Fab Technology Engineer for Surface Preparation and Integration (SPI) based in Taiwan to play a pivotal role in solving our customers' most challenging problems and identifying new opportunities in Selective Wet Etch and Clean area. This position will be at the forefront of customer adoption progression of existing and new products, providing technical leadership during launches and commercialization efforts for Entegris' SPI Material Solutions Business Unit. [In this role you will] Serve as the technical expert for Selective Wet Etch & Clean solutions, providing application support and leading customer evaluations, qualifications, and technical discussions. Drive business growth by identifying, developing, and converting customer opportunities while supporting SPI revenue goals in Taiwan. Build strong relationships with customers, account teams, and key OEM partners to develop new business opportunities and support long-term growth. Collaborate with Business Units, R&D, Supply Chain, and Quality teams to align product roadmap, operations, and customer requirements. Represent the region in business reviews, customer roadmap discussions, and global opportunity reviews. Deliver technical training and market insights to customers and internal stakeholders. Support customer engagement activities through domestic and international travel (up to 30%). [Traits we believe make a strong candidate] Bachelor’s, Master’s, or PhD degree in Chemistry, Chemical Engineering, Materials Science, or a related Engineering discipline. 8–10+ years of experience in Wet Etch & Clean processes within semiconductor manufacturing, equipment, or materials suppliers. Strong expertise in process development for advanced semiconductor technologies (Logic, Memory, or 3D architectures); experience with semiconductor equipment suppliers is preferred. Experience with surface analytical and characterization techniques is a plus. Strong analytical problem-solving, communication, and presentation skills, with the ability to work independently and collaboratively in a fast-paced environment. Fluent in English for technical discussions and customer presentations (TOEIC 600+ preferred). Sales, customer-facing, or people management experience is a plus. Based in Hsinchu or nearby areas, with flexibility to travel as required.About this role
Summary
Lead technical support and development for wet etch and clean in semiconductor fabrication.
Job title
Lead Engineer, Fab Technologies
Experience level
8+ years
Minimum experience
8+ years exp
Industry
technology
Location requirements
Hsinchu City, Taiwan; remote work not specified.
Salary
Not specified
Visa sponsorship
H-1B sponsor history
Management role
No
Skills & keywords
Required skills
process developmentsemiconductor manufacturingcustomer supportanalytical techniques
Preferred skills
surface analysiscustomer engagementsales experienceteam collaboration
Specializations
surface preparationwet etchclean processessemiconductor
Locations
Structured locations inferred from the posting.
Hsinchu, North District, Hsinchu City, Taiwan
Work arrangement unknown City
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