Lead Design Engineer

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

• Development, automation and maintenance of EDA flows and scripts for physical implementation
• Develop TFM to optimize PPA for IP’s and Soft Controllers
• PPA characterization and optimization of flow for performance-oriented and power-oriented best-in-class IP cores in advanced process nodes, on TSMC, Intel, Samsung and Rapidus Foundries
• Manage regression infrastructure that tracks quality of the RTL/flow development as well as the PPA of the key designs.
• Digital design implementation using Cadence EDA tools - Genus, Innovus, Conformal, Litmus, Tempus, Voltus, Certus, Pegasus and other backend tools
• Candidate will be working on automation of Full chip floorplanning using latest AI tools. Involving in active AI agent based partition for Full Chip Floorplanning.
• Required skills –
• Educational Qualification: MS/MTech/BE/ BTech  in Electronics from reputed institutes with 5 + years' experience
• Physical design experience in ASIC design environment
• Should have knowledge of complete ASIC Design Flow, including Synthesis, Physical Designing , Timing Analysis, Power Analysis and Formal Verification
• Should have excellent leadership, communication, analytical and problem solving skills.
• Expertise on High frequency design methodologies for complete ASIC backend flows.
• Candidate with experience in Full Chip (SoC level) floorplanning, pin assignment, global clock distribution across all subsystems is a plus point.
• Good communication skills, strong analytical problem solving skills and willingness to learn quickly.
• Solid scripting skills including Python and Tcl.
• Should be self-motivated and good team player.

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