IC Package Thermal Mechanical Engineer
Broadcom Corporation
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Job Description:
IC Package Thermal Mechanical Engineer
About the Role
This role focuses on the mechanical design and thermo-mechanical simulation of complex, advanced semiconductor packages used in high-performance computing (HPC), AI, and networking products. As an IC Package Engineer, you will leverage advanced multiphysics simulations to optimize reliability, ensure high product yield, and resolve manufacturing challenges from early product definition through New Product Introduction (NPI).
This position offers a dynamic balance: 70% advanced simulation and modeling work, and 30% hands-on lab experiments in reliability testing (e.g., Electromigration, Temperature Cycling [TCT], and drop tests).
Key Responsibilities
Advanced Simulation & Modeling (70%): Develop, perform, and validate advanced numerical Finite Element Analysis (FEA) and multiphysics models to evaluate package stress, strain, deformation, warpage, thermal cycling, and delamination.
Physics-Driven Design: Apply an in-depth understanding of structural mechanics, fluids, and heat transfer to solve complex chip-package and package-board interaction challenges.
Workflow Automation: Streamline simulation workflows by developing reusable model-generation, post-processing, design-of-experiments (DOE), and reliability-data-analysis tools (Ansys APDL, Python, or MATLAB). Leverage Machine Learning, Generative AI, and numerical tools to build automated user interfaces.
Empirical Reliability Lab Work (30%): Conduct and oversee hands-on reliability lab testing to investigate package failure mechanisms and utilize experimental data to define and predict overall product reliability.
Minimum Qualifications
Education & Experience: Bachelor's degree with 8+ years of relevant industry experience; OR a Master's degree with 6+ years; OR a PhD with 3+ years of experience in Mechanical Engineering, Material Sciences, or a related field with an emphasis on solid mechanics.
Core Engineering Knowledge: Deep understanding of electronic packaging structures and advanced materials. Ability to evaluate complex numerical simulations against first principles (e.g., strength of materials solutions). Working knowledge of electromigration and general silicon/IC packaging reliability.
FEA Proficiency: Hands-on expertise with major Finite Element Method (FEM) tools, specifically ANSYS (Classic/Mechanical).
Programming & Scripting: Strong capability in Ansys APDL, MATLAB, and Python.
Preferred Qualifications
Electromigration Reliability Experience: Experience supporting electromigration assessments by developing accelerated testing for package-level interconnects (including BGA balls, C4 bumps, Cu pillars, microbumps, and metallization structures), and partnering with failure-analysis teams to identify root causes of degradation.
Material Characterization: Hands-on experience performing mechanical testing and utilizing experimental material characterization metrologies (e.g., DMA/TMA, nano-indentation).
Thermal Analysis: Previous thermal engineering background utilizing tools such as Icepak and Flotherm.
Advanced Tech: Experience integrating Machine Learning and Gen-AI applications into engineering workflows is highly desired.
Compensation and Benefits
The annual base salary range for this position is USD 109,700.00 To USD 175,500.00
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Summary
Designs and simulates semiconductor packages, conducts reliability tests, optimizes product performance
Job title
IC Package Thermal Mechanical Engineer
Experience level
8+ years or 6+ years or 3+ years with degrees
Minimum experience
3+ years exp
Industry
semiconductor
Location requirements
On-site in Irvine, California, no remote option
Salary
$110k–$176k
Visa sponsorship
H-1B sponsor history
Management role
No
Required skills
Preferred skills
Specializations
Structured locations inferred from the posting.
Irvine, CA, USA