IC Design Engineer

Broadcom Corporation

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IND-Bangalore Electronic City - S1 Until 9/21/2026 H-1B sponsor history First posted July 23, 2026 Last posted July 23, 2026
Job description

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Job Description:

Block Level and Full chip level Static(IR)/Dynamic(IVD) sign-off

Power Estimation on blocks and full chip (both vector and vectorless)

Signal/Power EM sign-off at Block level and Full chip

Custom power grid implementation for block/hardmacs
System level Analysis (PDN) with board, package, interposer and die

Work with SoC and packaging team in bump assignment, pkg routing optimization
Dynamic analysis with vectorless/vectors/mixed mode analysis

PG Grid resistance checks

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

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About this role

Summary

Designs IC power, signal, and power grid analysis, and system-level analysis.

Job title

IC Design Engineer

Experience level

null

Industry

electronics

Location requirements

Bangalore, India; remote work not specified.

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

power estimationsignal EM sign-offpower grid implementationsystem analysis

Preferred skills

None specified

Specializations

power estimationsignal EM sign-offpower grid implementationsystem analysis
Locations

Structured locations inferred from the posting.

Bengaluru, Karnataka, India

Work arrangement unknown City