HBM Ecosystem Manager

Taipei City, Taipei City, Taiwan Until 8/23/2026 H-1B sponsor history First posted June 5, 2025 Last posted June 5, 2025
Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As an HBM Ecosystem Manager in the AI Solutions Group, you establish and maintain strong relationships with key ecosystem partners in the 2.5D High Bandwidth Memory (HBM) industry in Taiwan. You will be required to have a deep understanding of heterogeneous integration techniques which enable the manufacturing of advanced AI systems incorporating Micron’s best in class HBM. You will engage with leading OSAT companies such as TSMC, ASE/SPIL  to identify business opportunities and provide robust on-site business and technical support. Your work will be essential to the AI Solutions Group Product Management Team to secure business wins, while also ensuring the relevant internal technical teams get involved. You will collaborate closely with Micron’s local packaging technology development team to help devise strategic engagements for future HBM products, ensuring Micron continues to be at the forefront of new AI hardware platforms. You will also work with Micron’s local Operations teams during New Product Introduction (NPI) phases, contributing to business and revenue wins through executional excellence.

Key Responsibilities:

  • Manage multiple OSAT/heterogeneous integrator accounts, providing local support to enable the latest integration techniques affecting Micron’s HBM product portfolio.
  • Engage with key AI hardware related semiconductor companies in Taiwan to reinforce Micron’s position as a leading HBM supplier, including foundries, fabless ASIC, and IP vendors.
  • Work closely with the Advanced Packaging Technology Development (APTD) team to support defining product roadmaps and execution strategies aligned with integrating/packaging technology trends.
  • Provide Business Unit (BU) support and direction to local Operations teams during NPI phases of new HBM products, streamlining business enablement and execution.

Key Qualifications:

  • Minimum 6 years of experience in semiconductor packaging
  • Experience in 2.5D System in Package (SIP) manufacturing industry
  • Experience in DRAM manufacturing preferred
  • Master’s degree in engineering (Chemical, Material, Mechanical or Electrical Engineering)
  • Minimum 4 years of experience in customer technical support/engagement roles
  • Experience in business role preferable – product management, product planning, technical marketing.
  • Fluent in Mandarin with good, clear communication skills in English
  • Independent thinking, with strong sense of responsibility and proactive approach to ensure high standard of work is delivered on time

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

About this role

Summary

Manage relationships with ecosystem partners in the HBM industry.

Job title

HBM Ecosystem Manager

Experience level

6+ years

Industry

semiconductors

Location requirements

Located in Taipei City, Taiwan; remote work not allowed.

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

semiconductor packaging2.5D SIPDRAM manufacturingmaster's degreecustomer technical supportproduct managementmandarincommunication

Preferred skills

business roleproduct planningtechnical marketing

Specializations

semiconductorpackagingAIcustomer supportbusiness development
Locations

Structured locations inferred from the posting.

Taipei, Taiwan

On-site City