External Package Innovation Engineer

CZ61 NXP Semiconductors Czech Republic s.r.o.

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Kuala Lumpur Until 10/4/2026 H-1B sponsor history First posted August 5, 2026 Last posted August 5, 2026
Job description

Hiring: External Package Innovation Engineer

We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution.

🔹 Role Overview

As an EPI engineer, you will act as both a Role Owner and Key Supporter for OSAT-related development activities, ensuring robust execution from concept through production.

🔹 Key Responsibilities

 1. Role Owner (Strategic & Governance)

  • Own and lead OSAT-wide and cross-OSAT initiatives
  • Define and deploy standard development templates and success criteria across OSATs
  • Drive deployment of Best Known Methods (BKM) and lessons learned
  • Develop and maintain technology roadmap and capability assessment for each OSAT site
  • Provide Package Innovation (PI) input for:
    • External site sourcing strategy
    • Site selection process (jointly with interface manager)
  • Lead project governance, including:
    • Overall project summaries
    • Stoplight reporting
    • Regular reviews per OSAT site

 2. Supporter (Execution & Project Delivery)

  • Support NPI & NTI projects executed at external OSAT factories
  • Ensure OSAT compliance with:
    • Development processes
    • Required documentation/templates
  • Drive alignment on SME (Subject Matter Expert) assignment at OSAT
  • Support and resolve technical and project issues on-site and across time zones
  • Ensure assembly readiness and safe production launch

🔹 Stakeholder Collaboration

You will work closely with cross-functional teams, including:

  • Project Leaders & Development Managers
  • Designers & Materials Engineers
  • Tech Integration & Modelling teams (Electrical, Mechanical, Thermal)
  • API and WLP/PLP/FC SMEs
  • OSAT partners

🔹 What We’re Looking For

  • Strong experience in semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding).  Previous exposure to OSAT ecosystem is an added advantage.
  • Proven ability to manage cross-site, cross-functional projects
  • Solid understanding of NPI/NTI development flows
  • Excellent stakeholder management and communication skills
  • Ability to drive standardization, governance, and technical problem-solving

🌟 Why Join Us

  • Opportunity to lead high-impact package innovation initiatives
  • Work with global teams and OSAT partners for wide exposure and fast knowledge & skill growth
  • Drive technology roadmap and next-generation packaging solutions


More information about NXP in Malaysia...

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About this role

Summary

Manage and support semiconductor packaging innovation projects with cross-functional teams.

Job title

External Package Innovation Engineer

Experience level

professional level

Industry

semiconductor

Location requirements

Kuala Lumpur, on-site, no remote work allowed

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

semiconductor packagingcross-site project managementstakeholder managementNPI/NTI flowstechnical problem-solving

Preferred skills

OSAT ecosystem experienceassembly process expertisestandardizationgovernance

Specializations

semiconductor packagingassembly processwire bondingNPI/NTI
Locations

Structured locations inferred from the posting.

Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia

On-site City