Equipment Engineer

CZ61 NXP Semiconductors Czech Republic s.r.o.

Kuala Lumpur Until 8/21/2026 H-1B sponsor history First posted April 15, 2026 Last posted April 15, 2026

Job description

1.ATKL Packing Material Coordinator, accountable to drive total ATKL packing cost implementation, packing material standardization and packing quality across

2.Work collaboratively with equipment, manufacturing & supplier to improve packing quality related

3.LeadTBE NPI for packing related and ensure timely execution.

4.Lead or need to update SOP, SWE,OCAP, FMEA, Control plan related to packing process

5.Packing qualification (tray, carrier tape, cover tape, desiccant, hic, box, bubble wrap)

6.Update packing method changed in APL system

7.Packing material submission updating ( Enovia, Beeline, GMDM & MMPR)

8.APL full development and implementation

9.SOP, SWE,OCAP, FMEA, Control plan related to packing process

10.New item submit in MMPR GMDM for General Store ordering

11.Work with supplier on daily packing related issue.(ITW- Richard, CPAK- Sam DY on quality)

additional requirement

1.Educational background : Engineering Degree (Electronics or Mechanical or Mechatronics or Chemical)

2.Preferred working experience in semiconductor manufacturing and vision inspection.

3.Speedy, Multi-tasking, results-orientated and able to work in fast phase manufacturing environment.

4.Open-minded, willing to accept new challenges and overcome it with positive attitude.

5.Motivated team player with high level of ownership.

6.Able to communicate with all levels of people.

7.Knowledge/experience in programming language a plus.

More information about NXP in Malaysia...

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About this role

Summary

Manage packing processes, collaborate with suppliers, ensure quality, lead NPI, update SOPs and systems.

Job title

Equipment Engineer

Experience level

not specified

Industry

electronics manufacturing

Location requirements

Kuala Lumpur, on-site work only

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

Skills & keywords

Required skills

engineering degreeelectronicsmechanicalmechatronicschemicalsemiconductorvision inspectionprogramming

Preferred skills

programmingfast phase environmentmulti-taskingteam player

Specializations

packingqualificationsupplier coordinationSOPFMEA

Locations

Structured locations inferred from the posting.

Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia

On-site City