Bonding/RDL routing/Package Interface

Aarna HR Solutions Pvt Ltd

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Bengaluru, KA, in on site Until 8/21/2026 First posted April 21, 2026 Last posted April 21, 2026
Job description

Greeting!!

Aarna HR Solutions is a Human Resource Recruitment Company providing services to Various IT, ITES and Non- IT companies across India. Aarna HR Solutions strive towards hiring the best and the brightest talent in the industry. We hire individuals with a strong sense of pride in their performance, team spirit, and a desire to excel.

We have immediate openings for “Bonding
/RDL routing/Package Interface" for our Semiconductor client located in Bangalore.


About Position

Position: Bonding/RDL routing/Package Interface

Experience: 3+ Years

Location: Bangalore

Qualification: BE/ B Tech/ M tech


Job Description

  • Bonding/RDL routing/Package Interface
  • Power Strap Definition
  • Decap Analysis
  • Switch Cell Distribution strategy
  • IR/IVD/EM analysis & fix strategies


If interested please send your UPDATED Profile with below mentioned details.

Current CTC:

Expected CTC:

Notice Period:

Reason for Job Change:


With Regards,

Harshitha- HR Recruiter

Aarna HR Solutions Pvt Ltd

Mob No: 9036516137;


All your information will be kept confidential according to EEO guidelines.

About this role

Summary

Designs and analyzes bonding, routing, and package interfaces in semiconductor devices.

Job title

Bonding/RDL routing/Package Interface

Experience level

3+ years

Industry

semiconductor

Location requirements

Bangalore, in; remote work not specified

Salary

Not specified

Management role

No

Skills & keywords

Required skills

BondingRDL routingPackage InterfacePower Strap DefinitionDecap AnalysisSwitch Cell DistributionIR/IVD/EM analysis

Preferred skills

None specified

Specializations

semiconductorpackagingelectrical design
Locations

Structured locations inferred from the posting.

Bengaluru, Karnataka, India

On-site City