Assembly Backend Technician (System & Tooling )

CZ61 NXP Semiconductors Czech Republic s.r.o.

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Kuala Lumpur Until 8/21/2026 H-1B sponsor history First posted July 16, 2025 Last posted July 16, 2025
Job description

Responsibilities
a) Maintaining / sustaining Trim & Form System and Tooling in Assembly Backend
b) To perform a machine periodic Preventive Maintenance for system handler , tooling and laser marker c) To perform system and tooling conversion to support Manufacturing goal indices
d) Meeting Trim & Form machine Downtime and MTBA Goal
e) Meeting 90% PM success rate . No Machine downtime / No product quality issue after PM.
f) To perform Tooling Preventive Maintenance and periodic tooling health check inspection 
g) Spare Tool readiness and availability for quick tool changeover
h) Manage the maintenance activities of machines and fabrication of spare parts.
i) Good discipline and tardiness with minimum supervise

Requirement

Diploma in Electrical & Electronics or Mechanical and Engineering discipline, or certificate with min 5 years’ of relevant working experience in Assembly Backend equipment
Experience in semiconductor assembly and applied statistics will be an advantage
Have good technical skills on Assembly Back End assembly equipment
Strong interpersonal and communication skills
Good decision making / problem solving skills.
Familiar with production environment & possesses process handling knowledge. (Semiconductor).
 Must be discipline and willing to work long hours and shifts.
Must adhere NXP Total Quality Mindset and Safety Awareness.
Must adhere NXP core value Trust and Respect, Collaboration, Ownership, Expertise, Innovation and Growth.

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About this role

Summary

Maintain and sustain assembly backend systems and tooling, perform preventive maintenance, and manage machine activities.

Job title

Assembly Backend Technician (System & Tooling)

Experience level

5+ years

Industry

manufacturing

Location requirements

Located in Kuala Lumpur; remote work not allowed

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

diploma in electrical & electronicsmechanical engineering5 years relevant experiencetechnical skillsinterpersonal skillscommunicationdecision makingproblem solvingproduction environment knowledge

Preferred skills

semiconductor assemblyapplied statistics

Specializations

assemblymaintenancesemiconductortechnical skillsproblem solving
Locations

Structured locations inferred from the posting.

Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia

On-site City