Assembly Backend Process Engineer
CZ61 NXP Semiconductors Czech Republic s.r.o.
Apply to this job•Responsible for supporting backend process and improvement on assigned packages
•Responsible for quality, yield, cost and process improvement activities.
•Responsible for process documentation, process spec, standard work instruction, OCAP, Lead etc.
•Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.
•Take ownership to work closely with peers and management to drive assigned deliverables
Requirements:
•Candidate must possess at least a Bachelor's Degree in Engineering (Material Science/Electrical/Mechanical or equivalent).
•1-2 years of work experience with semiconductor assembly background for automotive customers (Fresh grads are encouraged to apply)
•Candidate must have great interpersonal skills, leadership skills, positive minded, self-driven and eager to strive for success.
•Passionate in continuous learning and drive for improvement
•Good SPC, Process Control and other relevant statistical & problem-solving skills
•Good in Microsoft application (PowerPoint, Excel Macro, Word, Auto CAD, etc.). •Project management knowledge is an added advantage.
Summary
Support backend process, quality, yield, cost, documentation, and cross-functional collaboration.
Job title
Assembly Backend Process Engineer
Experience level
1-2 years
Minimum experience
1+ years exp
Industry
semiconductor
Location requirements
Kuala Lumpur, on-site only
Salary
Not specified
Visa sponsorship
H-1B sponsor history
Management role
No
Required skills
Preferred skills
Specializations
Structured locations inferred from the posting.
Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia