Advanced Package Development Engineer

Join the team behind the technology in a billion pockets worldwide. Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products. In this role, you'll contribute to the advanced packaging technologies that enable Apple's industry-leading silicon performance. You'll work alongside world-class engineers to solve complex integration challenges and bring new packaging innovations from concept to mass production.

Description

Developing advanced packaging technologies in a cross-functional team. You will be responsible for Package integration and technology development.

We're looking for someone who:
• Has deep expertise in semiconductor packaging or related disciplines
• Thrives on solving difficult technical problems
• Holds themselves to a high standard of engineering excellence
• Is self-motivated and comfortable navigating ambiguity

Minimum Qualifications

BS and 10+ years of experience in relevant industry experience.

Preferred Qualifications

PhD and 6+ years of experience in relevant industry preferred.
Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch μ-bumps, hybrid bonds, TSVs, etc.
Deep knowledge of electrical, mechanical and thermal properties of fab materials.
Strong expertise in Si Fab equipment and Fab Logistics Management.
Experience on advanced packaging for groundbreaking CMOS nodes.
Expertise on Si structure yield and reliability mechanisms and analyses.
Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis.
Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT.
Capable of independent R&D Work in a cross-functional team, driving vendors.
Excellent communication skills.
Experience in Si fab integration role and advanced packaging.