Advanced Assembly Engineer (2.5-3D)

At Universal Quantum, we aim to make the world a better place by developing a new computer technology. Together, we are creating truly impactful quantum computers. Our machines will be capable of solving problems until now considered impossible, with applications ranging across a broad range of industries, including healthcare, materials and aerospace.

We are looking to hire an Advanced Assembly Engineer (2.5-3D) to develop, design, advanced assembly methods for quantum computers. Passionate about helping create technologies which can change the world? We may be the right place for you, so get in touch!  

What You’ll Accomplish 

• Develop assembly flows for various quantum computing devices 
• Drive methodology, innovation, and productivity improvements in assembly development internally and with external vendors 
• Initiate assembly concepts and lead advanced IC assembly development leveraging 2.5D and 3D assembly technologies 
• Select and manage external partners to ensure successful execution 

Requirements

The 3 Most Critical Attributes We’ll Use to Compare Candidates 

1. Deep Technical Expertise in semiconductor assembly, including 2.5D/3D integration and advanced IC assembly technologies 
2. Problem-Solving Ability with strong engineering fundamentals and experience resolving complex reliability and performance challenges 
3. Innovation and Leadership in driving new methodologies, collaborating with vendors, and improving design flows and productivity 

Must-have Skills 

• Semiconductor assembly experience, including wafer-level 2.5D/3D packaging 
• Design for Excellence (DFM, DFT) experience 
• Knowledge of common package technologies and materials 
• Familiarity with CAD tools and thermo-mechanical simulation. 
• Finite Element Modeling (FEM) for thermal, electrical, and mechanical simulations 
• Ability to resolve assembly reliability issues across wide temperature ranges 
• Understanding semiconductor assembly manufacturing and packaging/assembly failure mechanisms 
• Strong engineering problem-solving skills with solid physics fundamentals 
• PhD/master's degree in mechanical engineering, material science, physics, packaging, or micro/nanofabrication 
   

Nice-to-have Skills 

• Development of technology PDKs 
• Knowledge of Through-Silicon Via (TSV), silicon processing, and thin-film techniques 
• Electro-mechanical testing at cryogenic temperatures 
• High-voltage/power package qualification experience 
• Process engineering background