2027 Intern - Product/Test Development Engineer

CZ61 NXP Semiconductors Czech Republic s.r.o.

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Tianjin (Weiwu) Until 9/19/2026 0+ years exp H-1B sponsor history First posted July 21, 2026 Last posted July 21, 2026
Job description

Job Description:

This candidate will be part of the NXP Product and Test Engineering team working on Automotive Microcontroller. In this team the candidate will be working on:

  • Develop and debug test SW and HW to support silicon evaluation, characterization, qualification and mass production issues on ATE.
  • Work with worldwide cross-functional teams to identify root cause and find out solution to solve product issue.

Qualifications:

  • Pursuing in BS or MS in IC design, Micro-Electronics, Electronic, Computer Science or other related majors.
  • Familiar and Application of Microcontroller or Microprocessor.
  • Coding skill (C, C++, VB, Python, etc.)
  • Demonstrated strong problem-solving capability.
  • Good communication skill and teamwork spirit
  • Strong ownership, willing to learn, open to challenges and self-motivated.
  • Good level on oral and written English, CET6 or above.


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About this role

Summary

Assist in developing debug test software/hardware for automotive microcontrollers.

Job title

2027 Intern - Product/Test Development Engineer

Experience level

entry level

Minimum experience

0+ years exp

Industry

software

Location requirements

Tianjin, no remote work allowed

Salary

Not specified

Visa sponsorship

H-1B sponsor history

Management role

No

Skills & keywords

Required skills

CC++Pythonmicrocontrollerproblem-solvingcommunication

Preferred skills

microprocessor

Specializations

microcontrollertest developmentmicroelectronics
Locations

Structured locations inferred from the posting.

Tianjin, China

On-site City